Thermal stability of copper processed by multidirectional forging : effect of deformation amplitude and cumulative strain.

Simple item page
dc.contributor.authorFlausino, Paula Cibely Alves
dc.contributor.authorCorrêa, Elaine Carballo Siqueira
dc.contributor.authorPereira, Pedro Henrique Rodrigues
dc.contributor.authorAguilar, Maria Teresa Paulino de
dc.contributor.authorCetlin, Paulo Roberto
dc.date.accessioned2023-07-04T19:31:54Z
dc.date.available2023-07-04T19:31:54Z
dc.date.issued2022pt_BR
dc.description.abstractExperiments were performed in order to evaluate the effect of deformation amplitude (Δε) and cumulative strain (ε) on the thermal stability of Copper 99.8% pure, after processing with 8 and 48 Multidirectional forging (MDF) cycles at room temperature with Δε ≈ 0.075 (MDF0.075) or 2 and 12 MDF cycles with Δε ≈ 0.30 (MDF0.30), leading to cumulative deformations of ε ≈ 1.8 and 10.8. The microstructural stability at elevated temperatures was evaluated through Differential Scanning Calorimetry (DSC) and heat treatments, combined with Vickers microhardness measurements and Electron Backscattered Diffraction (EBSD). Further analyses were carried out through thermodynamic considerations about the stored energy and driving pressures for boundary migration. The results showed that the thermal stability associated with static recrystallization decreases as ε and Δε in MDF increase, due to the presence of finer grain structures and higher dislocation density in the as-deformed material. In addition, the MDF-processed specimens deformed with high ε and Δε exhibited finer recrystallized grains than those processed with low ε and Δε as a result of their increased number of nucleation sites. Thermal stability increases in the following order: 12C-MDF0.30, 2C-MDF0.30, 48C-MDF0.075 and 8C-MDF0.075.pt_BR
dc.identifier.citationFLAUSINO, P. C. A. et al. Thermal stability of copper processed by multidirectional forging : effect of deformation amplitude and cumulative strain. Materials Science and Engineering A, v. 846, artigo 143299, maio 2022. Disponível em: <https://www.sciencedirect.com/science/article/pii/S0921509322006979>. Acesso em: 15 mar. 2023.pt_BR
dc.identifier.doihttps://doi.org/10.1016/j.msea.2022.143299pt_BR
dc.identifier.issn0921-5093
dc.identifier.urihttp://www.repositorio.ufop.br/jspui/handle/123456789/16888
dc.identifier.uri2https://www.sciencedirect.com/science/article/pii/S0921509322006979pt_BR
dc.language.isoen_USpt_BR
dc.rightsrestritopt_BR
dc.subjectCopperpt_BR
dc.subjectThermal stabilitypt_BR
dc.subjectMultidirectional Forging - MDFpt_BR
dc.subjectSevere Plastic Deformation - SPDpt_BR
dc.subjectStrain amplitudept_BR
dc.titleThermal stability of copper processed by multidirectional forging : effect of deformation amplitude and cumulative strain.pt_BR
dc.typeArtigo publicado em periodicopt_BR
Files
Original bundle
Now showing 1 - 1 of 1
No Thumbnail Available
Name:
ARTIGO_ThermalStabilityCopper.pdf
Size:
14.01 MB
Format:
Adobe Portable Document Format
Description:
Download
License bundle
Now showing 1 - 1 of 1
No Thumbnail Available
Name:
license.txt
Size:
1.71 KB
Format:
Item-specific license agreed upon to submission
Description:
Download
Collections
DEMET - Artigos publicados em periódicos