Interface evaluation of a Bi–Zn eutectic solder alloy : effects of different substrate materials on thermal contact conductance.

Simple item page
dc.contributor.authorAzeredo, Rudimylla Septimio
dc.contributor.authorCruz, Clarissa Barros da
dc.contributor.authorXavier, Marcella Gautê Cavalcante
dc.contributor.authorLima, Thiago Soares
dc.contributor.authorGarcia, Amauri
dc.contributor.authorSpinelli, José Eduardo
dc.contributor.authorCheung, Noé
dc.date.accessioned2022-09-19T19:57:34Z
dc.date.available2022-09-19T19:57:34Z
dc.date.issued2021pt_BR
dc.description.abstractIndustry is searching for ways of improving the process control required for the manufacture of electronic circuitry. In this respect, a numerical mathematical model for thermal contact conductance of solder/substrate couples is developed based on an inverse heat conduction problem. The intention of this research is combining the model results and wetting experiments in order to determine if there is a compromise between them in the matter of the Bi–Zn eutectic alloy. Substrate materials considered as priority for the electronics industry were tested. It was found that the heat transfer coefficients (h) and the contact angles (θ) might be related to each other. The Bi–Zn/copper, Bi–Zn/nickel, Bi–Zn/Invar and Bi–Zn/steel couples, in this order, generated θ varying from the smallest to the largest as well as h from the largest to the smallest. Microstructural coarsening effect has been realized with higher spacing between Zn fibers (λZn) referring to a condition of worse heat extraction imposed by an alloy/substrate couple during solidification.pt_BR
dc.identifier.citationAZEREDO, R. S. et al. Interface evaluation of a Bi–Zn eutectic solder alloy: effects of different substrate materials on thermal contact conductance. International Journal of Thermal Sciences, v. 160, artigo 106685, 2021. Disponível em: <https://www.sciencedirect.com/science/article/pii/S1290072920311340>. Acesso em: 29 abr. 2022.pt_BR
dc.identifier.doihttps://doi.org/10.1016/j.ijthermalsci.2020.106685pt_BR
dc.identifier.issn1290-0729
dc.identifier.urihttp://www.repositorio.ufop.br/jspui/handle/123456789/15383
dc.identifier.uri2https://www.sciencedirect.com/science/article/pii/S1290072920311340pt_BR
dc.language.isoen_USpt_BR
dc.rightsrestritopt_BR
dc.subjectBi-Zn alloypt_BR
dc.subjectHeat transferpt_BR
dc.subjectSolidificationpt_BR
dc.subjectWettabilitypt_BR
dc.titleInterface evaluation of a Bi–Zn eutectic solder alloy : effects of different substrate materials on thermal contact conductance.pt_BR
dc.typeArtigo publicado em periodicopt_BR
Files
Original bundle
Now showing 1 - 1 of 1
No Thumbnail Available
Name:
ARTIGO_InterfaceEvaluationBi-Zn.pdf
Size:
6.53 MB
Format:
Adobe Portable Document Format
Description:
Download
License bundle
Now showing 1 - 1 of 1
No Thumbnail Available
Name:
license.txt
Size:
1.71 KB
Format:
Item-specific license agreed upon to submission
Description:
Download
Collections
DEENP - Artigos publicados em periódicos