Microstructural and segregation efects afecting the corrosion behavior of a high‐temperature Bi‐Ag solder alloy in dilute chloride solution.

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dc.contributor.authorAzeredo, Rudimylla Septimio
dc.contributor.authorCruz, Clarissa Barros da
dc.contributor.authorSilva, Bismarck Luiz
dc.contributor.authorGarcia, Amauri
dc.contributor.authorSpinelli, José Eduardo
dc.contributor.authorCheung, Noé
dc.date.accessioned2022-09-19T19:46:27Z
dc.date.available2022-09-19T19:46:27Z
dc.date.issued2021pt_BR
dc.description.abstractIn electronic devices the solder joint is exposed not only to the air but also to moistures and other corrosive media such as chlorine and sulfur compounds. Bi–Ag alloys meet the melting temperature requirement to be classifed as high-temperature solders, therefore, knowledge of corrosion behavior is important for a long-term reliability of Bi–Ag solder connections. However, corrosion studies of Bi–Ag alloys are quite restricted in the literature. In this study, the role of the representative length scale of the microstructure as well as of the efects of Ag segregation on the resulting corrosion behavior of Bi–4 wt% Ag alloy samples are investigated. Cyclic potentiodynamic polarization and electrochemical impedance spectroscopy measurements were performed, and an equivalent circuit was also proposed to simulate the electrochemical corrosion behavior. All the used techniques indicated a tendency of better corrosion resistance associated with the sample having coarser microstructure and less Ag content.pt_BR
dc.identifier.citationAZEREDO, R. S. et al. Microstructural and segregation efects afecting the corrosion behavior of a high‐temperature Bi‐Ag solder alloy in dilute chloride solution. Journal of Applied Electrochemistry, v. 51, p. 769-780, 2021. Disponível em: <https://link.springer.com/article/10.1007/s10800-021-01533-5>. Acesso em: 29 abr. 2022.pt_BR
dc.identifier.doihttps://doi.org/10.1007/s10800-021-01533-5pt_BR
dc.identifier.issn1572-8838
dc.identifier.urihttp://www.repositorio.ufop.br/jspui/handle/123456789/15381
dc.identifier.uri2https://link.springer.com/article/10.1007/s10800-021-01533-5pt_BR
dc.language.isoen_USpt_BR
dc.rightsrestritopt_BR
dc.subjectSolderspt_BR
dc.subjectBi–Ag alloypt_BR
dc.subjectMicrostructurept_BR
dc.subjectCorrosion resistancept_BR
dc.titleMicrostructural and segregation efects afecting the corrosion behavior of a high‐temperature Bi‐Ag solder alloy in dilute chloride solution.pt_BR
dc.typeArtigo publicado em periodicopt_BR
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