Souza, Wagner Barbosa deAbreu, Christian SilvaRodrigues, Guilherme DiasMageste, Aparecida BarbosaLemos, Leandro Rodrigues de2019-05-032019-05-032018SOUZA, W. B. de et al. Selective separation of Cu, Ni and Ag from printed circuit board waste using an environmentally safe technique. Journal of Environmental Management, v. 226, p. 76-82, nov. 2018. Disponível em: <https://www.sciencedirect.com/science/article/pii/S0301479718309204>. Acesso em: 7 mar. 2019.0301-4797http://www.repositorio.ufop.br/handle/123456789/11169Printed circuit boards (PCBs) make up a large part of e-waste and include high concentrations of high-value metals. Therefore, the recovery of these metals is interesting from both the environmental and economic points of view. Here, the extraction/separation of copper, nickel and silver from PCB leachate was studied using an aqueous two-phase system (ATPS) formed by triblock copolymers with an electrolyte and water, which is in compliance with the principles of green chemistry. The best conditions for the selective extraction consisted of 1-(2-pyridylazo)-2-naphthol (3.5 mmol kg−1) at pH = 6.0 in 6 sequential steps for the Cu(II), dimethylglyoxime (5.00 mmol kg−1) at pH = 9.0 for the Ni(II) and thiocyanate (5.20 mmol kg−1) at pH = 9.0 for the Ag(I). These conditions were applied sequentially for extraction of Cu, Ni and Ag from the PCB leachate, obtaining high separation factor (S) values between the analyte and the metallic concomitants (SCu,Ni = 1,460, SCu,Fe = 15,500, SCu,Ag = 15,900, SNi,Fe = 32,700, SNi,Ag = 34,700 and SAg,Fe = 4800). The maximum extraction percentages (%E) for Cu, Ni and Ag were 99.9%, 99.9% and 99.8%, respectively. After the extraction, a single step stripping process was performed, resulting in more than 82% of the ion available in a clean lower phase. For the first time, an ATPS has been used for sequential extraction of several metal analytes from a real sample.en-USrestritoAqueous two-phase systemsGreen chemistryIon separationElectronic hazardous wasteSelective separation of Cu, Ni and Ag from printed circuit board waste using an environmentally safe technique.Artigo publicado em periodicohttps://www.sciencedirect.com/science/article/pii/S0301479718309204https://doi.org/10.1016/j.jenvman.2018.08.049