Statistics for Thermal conductance at Sn‐0.5mass%Al solder alloy/substrate interface as a factor for tailoring cellular/dendritic growth.
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| Thermal conductance at Sn‐0.5mass%Al solder alloy/substrate interface as a factor for tailoring cellular/dendritic growth. | 57 |
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| May 2024 | 0 |
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| ARTIGO_ThermalConductanceSn.pdf | 5 |
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