Thermal conductance at Sn‐0.5mass%Al solder alloy/substrate interface as a factor for tailoring cellular/dendritic growth.

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dc.contributor.authorOliveira Junior, Ricardo
dc.contributor.authorCruz, Clarissa Barros da
dc.contributor.authorBarros, André dos Santos
dc.contributor.authorBertelli, Felipe
dc.contributor.authorSpinelli, José Eduardo
dc.contributor.authorGarcia, Amauri
dc.contributor.authorCheung, Noé
dc.date.accessioned2022-09-19T20:06:39Z
dc.date.available2022-09-19T20:06:39Z
dc.date.issued2022pt_BR
dc.description.abstractThe use of Al for replacing high-cost alloying metals, like Ag, Bi, and Cu, as the second major element in Sn-based alloys, arises as a promising alternative for the development of low-cost Pb-free solder alloys. To date, however, the interfacial characteristics of Sn–Al solder joints in electronic substrates remain barely explored. Thus, the present study focuses on an understanding of the mechanisms afecting the heat transfer efciency between a Sn–Al eutectic alloy and two types of substrates, establishing correlations with the microstructure evolution. Results of solidifcation experiments coupled with mathematical modeling demonstrate an interfacial thermal conductance between the Ni substrate and the Sn-0.5mass%Al alloy higher than that observed for the Sn–Al/Cu couple. Furthermore, Al-rich intermetallics are shown to occur at the interfacial reaction layers for both tested conditions. While dendritic and dendritic/cellular morphologies predominate in the solidifcation of the Sn–Al eutectic alloy in a Cu substrate, the better heat extraction through the Ni substrate induces the growth of refned high-cooling rate cells. Then, growth laws relating the length scale of the Sn-matrix, represented by cellular or primary dendritic spacings, to solidifcation thermal parameters such as cooling rate and growth rate are proposed.pt_BR
dc.identifier.citationOLIVEIRA JUNIOR, R. et al. Thermal conductance at Sn‐0.5mass%Al solder alloy/substrate interface as a factor for tailoring cellular/dendritic growth. Journal of Thermal Analysis and Calorimetry, v. 147, p. 4945-4958, 2022. Disponível em: <https://link.springer.com/article/10.1007/s10973-021-10755-w>. Acesso em: 29 abr. 2022.pt_BR
dc.identifier.doihttps://doi.org/10.1007/s10973-021-10755-wpt_BR
dc.identifier.issn1588-2926
dc.identifier.urihttp://www.repositorio.ufop.br/jspui/handle/123456789/15384
dc.identifier.uri2https://link.springer.com/article/10.1007/s10973-021-10755-wpt_BR
dc.language.isoen_USpt_BR
dc.rightsrestritopt_BR
dc.subjectSn–Al eutectic alloypt_BR
dc.subjectPb-free solderspt_BR
dc.subjectSolder/substrate heat transferpt_BR
dc.subjectSolidifcationpt_BR
dc.subjectMicrostructurept_BR
dc.titleThermal conductance at Sn‐0.5mass%Al solder alloy/substrate interface as a factor for tailoring cellular/dendritic growth.pt_BR
dc.typeArtigo publicado em periodicopt_BR
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